Industry Insights

On the track of new energy batteries, molds serve as the physical bridge connecting design and product. As the core links of modern mold manufacturing, design and simulation are primarily enabled by two major technologies: CAD (Computer-Aided Design) and CAE (Computer-Aided Engineering). At HiNA, from laboratory breakthroughs to mass production on the line, molds are the critical link that grounds technological innovation in reality.

Mold Design (CAD): From Sketches to 3D Digital Models

CAD technology replaces traditional blueprints and physical mockups, allowing designers to "build" the mold entirely within the computer.

Core Workflow: Based on the product's functional, aesthetic, and structural requirements, designers create a 3D product model in CAD software (such as UG, Pro/E, SolidWorks, etc.). They then design every component of the mold, including parting surfaces, gating systems, cooling channels, and ejection mechanisms. Finally, all components are virtually assembled to check for any interference.

Core Value: The design process is highly flexible—any parameter can be modified and optimized at any time, enabling "top-down" design changes. Additionally, realistic rendering of the model allows for visual evaluation of the product's appearance at the design stage. This serves as the data source for the entire manufacturing process, with all subsequent analysis and machining based upon it.

Mold Simulation (CAE): Conducting "Trial Molds" Inside the Computer

CAE is the pivotal step that elevates mold design from "experience-based" to "data-driven" practice. Like a high-precision virtual laboratory, it simulates the mold's working process before the physical mold is even manufactured, allowing potential issues to be identified and resolved in advance.

Core Workflow: First, the CAD model is discretized into finite elements (meshing). Then, boundary conditions such as material properties, injection pressure, and temperature are defined, and appropriate analysis modules are selected for computation.

Common Simulation Analysis Types:

·Filling and Flow Analysis: Simulates how the plastic melt or liquid metal fills the mold cavity, predicting defects such as short shots, trapped air, or flow marks, thereby optimizing gate locations and runner designs.

·Cooling Analysis: Simulates the mold's cooling process to optimize cooling channel layouts, reducing cycle times and minimizing product warpage.

·Warpage Analysis: Predicts the tendency and magnitude of product deformation after cooling, and aids in designing pre-deformation (compensation) in the mold to achieve "reverse correction for positive results."

·Structural and Fatigue Analysis: Evaluates the strength and stiffness of the mold under high pressure and high temperature, predicts its fatigue life, and prevents cracking or failure during service.

·Motion Simulation: Simulates the opening/closing actions of moving components such as sliders and angled lifters to check for motion interference.

At Haina, every mold is honed through countless iterations in the digital world. By completing the majority of verification and modification work inside the computer, we significantly reduce the number of physical trial runs, shorten development cycles, improve mold quality, and lower overall costs.

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